Photolithography Wafers
  • Photolithography Wafers
  • Photolithography Wafers
Photolithography Wafers
Photolithography Wafers

Technical Specifications​

​Process​​Capability & Precision​
Photoresist CoatingSpin Coating: Thickness accuracy ≤ 3% (flat surfaces)
Photoresist CoatingSpray Coating: Thickness accuracy ≤ 10% (flat/irregular surfaces)
Lithography Accuracy2μm registration accuracy: 0.15μm
Development Accuracy2μm development uniformity < 5%
Etching Dimensional Tolerance±1μm

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