Substrate Wafers
Customization Supported: Yes
Shipping Location: Shenzhen, Guangdong Province, China
Brand: Dinghongrun
E-mail: dhr@dinghongrun.com
WhatsApp: +8613629515219
Product Description
Substrate wafers serve as foundational materials in semiconductor device manufacturing, providing structural support for functional layer integration. We offer customized substrate wafers tailored to specific technical requirements.
Technical Specifications
| Parameter | Specification |
|---|---|
| Material | Glass, Quartz, etc. |
| Diameter | 4”, 6”, 8”, 12” (customizable) |
| Diameter Tolerance | ±0.01mm |
| Min. Thickness | 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) |
| TTV (Total Thickness Variation) | <1μm |
| Bow | <20μm |
| Warp | <30μm |
| Surface Quality | 20-10 Scratch/Dig |
| Surface Roughness (Ra) | <0.2nm |
| Edge Profiling | 45° chamfer, C0.2±0.1mm |
| Coating Options | AR, HR, Beamsplitter coatings |
Note: Fully customizable to meet specific client requirements.