Through-Glass Via (TGV) Wafers
Customization Supported: Yes
Shipping Location: Shenzhen, Guangdong Province, China
Brand: Dinghongrun
E-mail: dhr@dinghongrun.com
WhatsApp: +8613629515219
Technical Specifications
| Parameter | TGV Specifications |
|---|---|
| Material | Glass, Quartz, etc. |
| Wafer Size | 4”, 6”, 8”, 12”, etc. |
| Min. Thickness | 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) |
| Min. Aperture | 20μm |
| Taper Angle | 3~8° |
| Via Pitch | 50μm, 100μm, 150μm, etc. |
| Max. Aspect Ratio | 1:10 |
| Metal Coating | Processable* |
* Note: Customizable according to customer requirements