Glass through-hole revolution: how TGV wins the future with cost-effectiveness
In the field of electronic packaging, a quiet cost revolution is under way. Glass through hole （ TGV ）Technology is challenging the dominant position of traditional hole technology with its amazing cost-effectiveness.
In the semiconductor industry, every micron of progress requires great efforts and costs. When we talk about the interconnection technology in electronic packaging, the cost factor is often decisive. Although traditional technologies such as TSV (silicon through hole) are mature, their cost structure has become increasingly unbearable.
The appearance of TGV technology, like a breeze, brings the possibility of change. It passes through Micro through-hole on glass substrate The electrical connection is realized, which not only has excellent performance, but also, more importantly, it performs surprisingly in terms of cost efficiency.
01 Disruptive differences in cost structure
When we disassemble the cost structure of TGV and traditional technology, the difference is shocking. In the cost of TSV technology, Through hole etching accounts for up to 44% , followed by through hole filling and thinning, respectively 25% and 24%.
Such cost structure is increasingly difficult to maintain in today’s competitive market environment. In contrast, the production cost of TGV technology is only one eighth of that of silicon based adapter plate.
This cost advantage mainly comes from the fact that TGV technology does not need to make insulating layer, which greatly reduces the process complexity and processing cost. Like an enterprise reform to streamline processes, TGV removes all unnecessary steps and only retains the core value creation link.
02 Advantages of material cost and consumables
In terms of materials, TGV has more obvious advantages. The cost of glass substrate itself is lower than that of silicon substrate, which makes TGV take the lead in the starting line.
what’s more, Advanced laser glass drilling technology realizes the processing process of “almost zero consumables” Unlike traditional water jet drilling, which needs to consume a large amount of water resources and abrasives continuously, laser processing consumes almost nothing except a small amount of electrical energy required for equipment operation.
This means that enterprises no longer need to invest additional manpower, material resources and financial resources for wastewater treatment, waste transportation and stacking. These savings in derivative costs further expand the cost advantage of TGV technology.
03 Performance cost ratio in high-frequency applications
In addition to direct cost advantages, the performance of TGV in high-frequency applications also brings indirect cost benefits. The dielectric constant of glass material is only about 1/3 of that of silicon The loss factor is 2-3 orders of magnitude lower than that of silicon material.
This means that the loss in signal transmission is greatly reduced and the integrity of the transmission signal is guaranteed. In practical applications, this can simplify circuit design, reduce the need for relay amplification equipment, and thus reduce the overall system cost.
In high-frequency application scenarios such as 5G communication and RF chips, this performance advantage translates into real cost savings. Designers no longer need to add complex circuits to compensate for signal loss, and the system becomes more simple and efficient.
04 Cost prospect of large-scale production
The cost-effectiveness of any technology is inseparable from the prospect of large-scale production. At present, TGV technology has shown application potential in many fields.
In the field of semiconductor packaging, TSMC, Samsung and other enterprises have used it for advanced packaging, achieving a 40% increase in chip stack density. In the field of consumer electronics, the folding screen mobile phones of Apple and Samsung use TGV technology to connect the flexible display screen and touch circuit, reducing the thickness by 15%.
With the expansion of application scope, The mass production capacity and technical maturity of TGV equipment are constantly improving Sukos Semiconductor has achieved the delivery of the fifth batch of TGV electroplating equipment, marking that the technology is maturing.
05 Realistic challenges and comprehensive assessment
Of course, TGV technology also faces its own challenges. High electroplating time and cost, easy delamination between substrate and metal layer And other problems limit its development.
Compared with silicon materials, the surface of glass is too smooth, and its adhesion to common metals (such as Cu) is poor, which is easy to cause delamination, resulting in curling or even falling off of the metal layer. These problems increase the process difficulty and quality risk, which may lead to potential cost increase.
However, from the perspective of comprehensive assessment, the cost-benefit advantage of TGV technology is still obvious. With the improvement of process and the maturity of technology, these problems are being solved gradually.
The cost advantage of TGV technology is not only reflected in the manufacturing process, but also extends to the entire product life cycle. The cost of glass substrate is only 1/8 of that of silicon adapter plate And no additional insulation layer deposition is required, greatly reducing the packaging cost.
With the increasing sensitivity of the semiconductor industry to cost, TGV, a technology that can give consideration to both performance and cost, is gaining more and more attention.
In the future, with the advancement of process innovation and large-scale production, the cost-benefit advantage of TGV technology will be further amplified. It is likely to become the mainstream choice in the field of electronic packaging and redefine the cost structure of the industry.
This cost revolution has just begun, but it has already let us see a more inclusive future of semiconductor technology.