With the increasing function and integration of electronic products, packaging technology has gradually become an important factor affecting product p…

In the race for device miniaturization and performance limit, a technology originating from semiconductor packaging is quietly changing the gene of in…

Glass substrate As an important material, it is widely used in modern industry, especially in displays, solar cells, photovoltaic industry and biomedi…

Photoetching is one of the key steps in modern semiconductor manufacturing, which is widely used in chip production, microelectronic device manufactur…

Glass substrate It plays a vital role in modern electronic equipment, especially in the production of displays, solar cells and electronic components.…

As an important micro machining technology, glass substrate micro via technology has been widely used in semiconductor, electronic packaging, optical …

In the traditional high-speed circuit design, the signal integrity loss in the tiny hole is like an unsolved puzzle, which continues to puzzle enginee…

In modern electronic packaging technology, glass has become a critical high-performance material widely used in various advanced technological product…

Technical Specifications​​ Parameter TGV Specifications ​​Material​​ Glass, Quartz, etc. ​​Wafer Size​​ 4”, 6”, 8”, 12”, etc. ​​Min. Thickness​​ 0.2mm…

We provide customized packaging wafers for advanced semiconductor applications, engineered to meet specific performance requirements in microelectroni…