Carrier Wafers
Customization Supported: Yes
Shipping Location: Shenzhen, Guangdong Province, China
Brand: Dinghongrun
E-mail: dhr@dinghongrun.com
WhatsApp: +8613629515219
Technical Specifications
| Parameter | Specification |
|---|---|
| Material | Glass, Quartz, etc. |
| Diameter | 4”, 6”, 8”, 12” (customizable) |
| Diameter Tolerance | ±0.01mm |
| Min. Thickness | 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) |
| TTV (Total Thickness Variation) | <1μm |
| Bow | <20μm |
| Warp | <30μm |
| Surface Quality | 20-10 Scratch/Dig |
| Surface Roughness (Ra) | <0.2nm |
| Edge Profiling | 45° chamfer, C0.2±0.1mm |
| Coating Options | AR, HR, Beamsplitter coatings |
Note: Fully customizable to meet specific client requirements.