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  1. 鼎宏润首页
  2. Grooved Glass Cover Plate
  • Application of glass thinning technology in electronic equipment

    Application of glass thinning technology in electronic equipment

    A piece of glass with a thickness of only 30 microns (0.03mm), which is a quarter thinner than A4 paper, can withstand more than 1 million times Bend without breaking. This achievement, which seems to violate the common sense of materials, is quietly…

    Industry News 2025 年 8 月 27 日
  • Application of Etching Technology in Optoelectronic Materials

    Application of Etching Technology in Optoelectronic Materials

    Photoelectric materials are an indispensable part of modern science and technology, and are widely used in many fields such as display technology, solar cells, laser equipment and sensors. In these applications, etching technology, as an important pr…

    Industry News 2025 年 8 月 20 日
  • Breaking AI computing bottleneck: technical revolution and engineering breakthrough of glass substrate packaging

    Breaking AI computing bottleneck: technical revolution and engineering breakthrough of glass substrate packaging

    A silent revolution is taking place in the field of semiconductor packaging. With the proliferation of AI chip transistors, the traditional organic substrate has become exhausted: AMD’s new generation EPYC processor integrates 192 cores, NVIDIA…

    Industry News 2025 年 8 月 20 日
  • Grating etching technology: an important tool in the field of micro machining

    Grating etching technology: an important tool in the field of micro machining

    Grating Etching technology, as a key process in the field of micro machining, is widely used in high-tech industries such as optics, communication, semiconductor, etc. Its unique process flow and significant technical advantages make grating etching …

    Industry News 2025 年 8 月 18 日
  • Glass Through Hole (TGV) Technology: Breaking the Bottleneck of Micromachining and High Density Interconnection Revolution

    Glass Through Hole (TGV) Technology: Breaking the Bottleneck of Micromachining and High Density Interconnection Revolution

    In the evolution of semiconductor packaging towards high-density, high-frequency and three-dimensional integration, glass substrate has become the core carrier of a new generation of advanced packaging by virtue of its excellent high-frequency charac…

    Industry News 2025 年 8 月 18 日
  • Semiconductor etching technology: precision processing promotes the progress of microelectronics industry

    Semiconductor etching technology: precision processing promotes the progress of microelectronics industry

    As one of the core processes in microelectronics manufacturing, semiconductor etching technology is widely used in integrated circuit (IC), micro electromechanical system (MEMS) and other fields. With the continuous development of the semiconductor i…

    Industry News 2025 年 8 月 11 日
  • Glass Etching: Surface Engineering Revolution from Light Control to Chip Interconnection

    Glass Etching: Surface Engineering Revolution from Light Control to Chip Interconnection

    The molecular layer on the surface of glass is quietly changing the face of modern industry. When the hydrofluoric acid solution reacts with silica, or the picosecond laser beam accurately bombards the glass surface, the etching process of the micro …

    Industry News 2025 年 8 月 4 日
  • Glass via interconnection technology: packaging revolution of high-frequency chips

    Glass via interconnection technology: packaging revolution of high-frequency chips

    In the field of high-end chip packaging, a silent technological change is taking place. When the high frequency loss and complex process of silicon substrate gradually become the bottleneck of computing power improvement, a new interconnection techno…

    Industry News 2025 年 8 月 4 日
  • Selection of optical coating suppliers and analysis of technical advantages

    Selection of optical coating suppliers and analysis of technical advantages

    In the modern optical industry, optical coating technology is one of the key means to improve the performance of optical elements. Optical coating can improve light transmittance, enhance specular reflection, reduce reflection loss, etc. It is widely…

    Industry News 2025 年 7 月 30 日
  • Current Status and Future Development of Semiconductor Etching Technology

    Current Status and Future Development of Semiconductor Etching Technology

    The development of semiconductor technology has profoundly changed the design and manufacturing of modern electronic equipment. As one of the core processes in semiconductor processing, etching technology plays a crucial role. With the continuous dev…

    Industry News 2025 年 7 月 22 日
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  • 鼎宏润科技突破蓝宝石球‑不锈钢管球面封接工艺 特种光学探头实现国产化量产 鼎宏润科技突破蓝宝石球‑不锈钢管球面封接工艺 特种光学探头实现国产化量产
  • 2026年玻璃金属化市场规模预测与增长驱动 2026年玻璃金属化市场规模预测与增长驱动
  • 玻璃金属化:解锁光模块高速传输的核心密钥 玻璃金属化:解锁光模块高速传输的核心密钥
  • 从"透明绝缘体"到"光电融合体":玻璃金属化如何重塑光通信与光模块 从”透明绝缘体”到”光电融合体”:玻璃金属化如何重塑光通信与光模块
  • 鼎宏润为高新技术企业提供批量玻璃金属化服务 鼎宏润为高新技术企业提供批量玻璃金属化服务

近期文章

  • 蓝宝石球探头
  • 鼎宏润科技突破蓝宝石球‑不锈钢管球面封接工艺 特种光学探头实现国产化量产
  • 2026年玻璃金属化市场规模预测与增长驱动
  • 玻璃金属化:解锁光模块高速传输的核心密钥
  • 从”透明绝缘体”到”光电融合体”:玻璃金属化如何重塑光通信与光模块

产品中心

  • 半导体高功率激光器基板

    半导体高功率激光器基板

  • LED封装玻璃透镜 玻璃盖板样式01

    LED封装玻璃透镜 玻璃盖板样式01

  • 衬底晶圆

    衬底晶圆

  • 蓝宝石球探头

    蓝宝石球探头

  • 钙钛矿太阳能电池凹槽玻璃盖板,钙钛矿光伏电池保护玻璃盖板

    钙钛矿太阳能电池凹槽玻璃盖板,钙钛矿光伏电池保护玻璃盖板

  • 玻璃蚀刻加工

    玻璃蚀刻加工

常见问题

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  • 问:贵公司光电玻璃光学性能如何?
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