9月2日，欧菲光发布”光启未来”战略，把玻璃基先进封装和TGV列为新赛道的核心，还专门成立光学微纳器件公司、参股半导体企业往先进封装玻璃基板延伸。一家做光学起家的龙头，为什么突然扎进玻璃基板？ 把时间线往前拉一周，信号就更清楚了。康宁在6月推出 Glass Bridge 玻璃光互连平台，把光通信的竞争从800G、1.6T光模块，直接下沉到玻璃基板、光耦合和CPO封装接口；沃格光电、通格微在2026年初已经完成了1.6T光模块CPO产品的玻璃基送样。一条越来越清楚的产业链信…

In the field of electronic packaging, a quiet cost revolution is under way. Glass through hole （ TGV ）Technology is challenging the dominant position of traditional hole technology with its amazing cost-effectiveness. In the semiconductor industry, e…

With the progress of science and technology and the growing demand for electronic products, Glass substrate As an important basic material, it has become an indispensable part of modern manufacturing. Especially in display technology, optoelectronic …

A silent revolution is taking place in the field of semiconductor packaging. With the proliferation of AI chip transistors, the traditional organic substrate has become exhausted: AMD’s new generation EPYC processor integrates 192 cores, NVIDIA…

In the evolution of semiconductor packaging towards high-density, high-frequency and three-dimensional integration, glass substrate has become the core carrier of a new generation of advanced packaging by virtue of its excellent high-frequency charac…

In the wave of semiconductor packaging technology evolving to 3D integration, Glass through hole （ TGV ）With the high frequency electrical characteristics, excellent insulation and adjustable coefficient of thermal expansion of glass materials, techn…

In the field of high-end chip packaging, a silent technological change is taking place. When the high frequency loss and complex process of silicon substrate gradually become the bottleneck of computing power improvement, a new interconnection techno…

With the increasing function and integration of electronic products, packaging technology has gradually become an important factor affecting product performance, reliability and cost. Among many packaging materials, Glass substrate Because of its exc…

In the race for device miniaturization and performance limit, a technology originating from semiconductor packaging is quietly changing the gene of intelligent devices. Glass through hole (TGV) technology – through Glass substrate To build a ve…

Glass substrate As an important material, it is widely used in modern industry, especially in displays, solar cells, photovoltaic industry and biomedical fields. With the continuous development of science and technology, the performance and applicati…