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  • Glass via interconnection technology: packaging revolution of high-frequency chips

    Glass via interconnection technology: packaging revolution of high-frequency chips

    In the field of high-end chip packaging, a silent technological change is taking place. When the high frequency loss and complex process of silicon substrate gradually become the bottleneck of computing power improvement, a new interconnection techno…

    Industry News 2025 年 8 月 4 日
  • Discussion on effective methods and technologies for improving adhesion of sapphire metallized layer

    Discussion on effective methods and technologies for improving adhesion of sapphire metallized layer

    In the manufacture of modern semiconductor and optoelectronic devices, sapphire, as an important substrate material, is widely used in LED, laser and various high-efficient optoelectronic devices. However, when attaching the metal layer to the sapphi…

    Industry News 2025 年 8 月 4 日
  • High precision glass thinning: from micron level game to precision manufacturing revolution of industrial breakthrough

    High precision glass thinning: from micron level game to precision manufacturing revolution of industrial breakthrough

    The “lightweight” demand of modern industry for glass has gone beyond simple size reduction and become an extreme game of material science, process control and engineering implementation. When the thickness of the cover glass of the foldi…

    Industry News 2025 年 7 月 30 日
  • Study on durability and reliability of quartz glass metallization

    Study on durability and reliability of quartz glass metallization

    Quartz glass is widely used in many high-tech fields due to its excellent physical and chemical properties. Especially in electronics, optics, aerospace and other industries, quartz glass has become a key material due to its high temperature resistan…

    Industry News 2025 年 7 月 28 日
  • Key to improving the performance of electronic products: analysis of packaging technology of high-performance glass substrate

    Key to improving the performance of electronic products: analysis of packaging technology of high-performance glass substrate

    With the increasing function and integration of electronic products, packaging technology has gradually become an important factor affecting product performance, reliability and cost. Among many packaging materials, Glass substrate Because of its exc…

    Industry News 2025 年 7 月 28 日
  • Femtosecond laser sapphire micro welding technology: application prospects and challenges

    Femtosecond laser sapphire micro welding technology: application prospects and challenges

    With the development of science and technology, laser technology has gradually entered into various fields of industrial manufacturing, especially in the field of precision machining and micro machining. Among them, femtosecond laser sapphire micro w…

    Industry News 2025 年 7 月 28 日
  • Application of Sapphire Metallization in Precision Instruments

    Application of Sapphire Metallization in Precision Instruments

    With the rapid development of science and technology, the performance requirements of precision instruments are constantly improving, and the selection of their materials has become particularly critical. Among them, sapphire, as a material with exce…

    Industry News 2025 年 7 月 22 日
  • Current Status and Future Development of Semiconductor Etching Technology

    Current Status and Future Development of Semiconductor Etching Technology

    The development of semiconductor technology has profoundly changed the design and manufacturing of modern electronic equipment. As one of the core processes in semiconductor processing, etching technology plays a crucial role. With the continuous dev…

    Industry News 2025 年 7 月 22 日
  • Revolution of glass substrate: how TGV technology reshapes the core architecture of intelligent devices

    Revolution of glass substrate: how TGV technology reshapes the core architecture of intelligent devices

    In the race for device miniaturization and performance limit, a technology originating from semiconductor packaging is quietly changing the gene of intelligent devices. Glass through hole (TGV) technology – through Glass substrate To build a ve…

    Industry News 2025 年 7 月 22 日
  • Endoscope lens welding technology: improve the precision and safety of medical equipment

    Endoscope lens welding technology: improve the precision and safety of medical equipment

    With the continuous progress of medical technology, endoscopic technology is increasingly widely used in medical diagnosis and treatment, especially in the field of minimally invasive surgery. As an important medical device, the precision and stabili…

    Industry News 2025 年 7 月 22 日
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  • 石英玻璃金属化在半导体制造中的应用与技术优势 石英玻璃金属化在半导体制造中的应用与技术优势
  • 化学镀镍工艺在玻璃金属化中的应用与优势 化学镀镍工艺在玻璃金属化中的应用与优势
  • 离子束溅射技术:提升玻璃金属化性能的革新之选 离子束溅射技术:提升玻璃金属化性能的革新之选
  • MEMS玻璃金属化:助力微机电系统在高科技领域的应用与创新 MEMS玻璃金属化:助力微机电系统在高科技领域的应用与创新
  • 低温玻璃金属化工艺:推动电子、光电和智能制造行业的创新应用 低温玻璃金属化工艺:推动电子、光电和智能制造行业的创新应用

近期文章

  • 石英玻璃金属化在半导体制造中的应用与技术优势
  • 化学镀镍工艺在玻璃金属化中的应用与优势
  • 离子束溅射技术:提升玻璃金属化性能的革新之选
  • MEMS玻璃金属化:助力微机电系统在高科技领域的应用与创新
  • 低温玻璃金属化工艺:推动电子、光电和智能制造行业的创新应用

产品中心

  • 硅表面金属化,可用于焊接

    硅表面金属化,可用于焊接

  • 蓝宝石金属化,蓝宝石保护光窗

    蓝宝石金属化,蓝宝石保护光窗

  • 陶瓷基板金属化

    陶瓷基板金属化

  • LED封装玻璃透镜 玻璃盖板样式08

    LED封装玻璃透镜 玻璃盖板样式08

  • 芯片电阻 垂直限流电阻

    芯片电阻 垂直限流电阻

  • 反射膜-镀膜加工

    反射膜-镀膜加工

常见问题

  • 问:贵公司光电玻璃产品发货地在哪里?
  • 单晶锗用途有哪些?
  • 氟化镁晶体用途都有什么?
  • 问:贵公司光电玻璃是否容易清洁 ?
  • 问:贵公司光电玻璃能抗多高温度 ?
  • 超白玻璃为什么要比普通的玻璃要贵

标签云

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