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  1. 鼎宏润首页
  2. Glass Processing
  3. 第2页
  • Breaking AI computing bottleneck: technical revolution and engineering breakthrough of glass substrate packaging

    Breaking AI computing bottleneck: technical revolution and engineering breakthrough of glass substrate packaging

    A silent revolution is taking place in the field of semiconductor packaging. With the proliferation of AI chip transistors, the traditional organic substrate has become exhausted: AMD’s new generation EPYC processor integrates 192 cores, NVIDIA…

    Industry News 2025 年 8 月 20 日
  • Durability of glass thinning

    Durability of glass thinning

    As a widely used material, glass plays an indispensable role in many fields such as architecture, electronics, automobile, etc. In recent years, with the progress of technology, Glass thinning Technology has gradually become an important direction to…

    Industry News 2025 年 8 月 18 日
  • Application prospect of sapphire metallization in aerospace field

    Application prospect of sapphire metallization in aerospace field

    Sapphire, as an excellent material, has been widely used in many high-tech fields due to its excellent hardness, thermal conductivity and optical transparency. With the progress of aerospace technology, Sapphire metallization As an important part, te…

    Industry News 2025 年 8 月 18 日
  • Grating etching technology: an important tool in the field of micro machining

    Grating etching technology: an important tool in the field of micro machining

    Grating Etching technology, as a key process in the field of micro machining, is widely used in high-tech industries such as optics, communication, semiconductor, etc. Its unique process flow and significant technical advantages make grating etching …

    Industry News 2025 年 8 月 18 日
  • Glass Through Hole (TGV) Technology: Breaking the Bottleneck of Micromachining and High Density Interconnection Revolution

    Glass Through Hole (TGV) Technology: Breaking the Bottleneck of Micromachining and High Density Interconnection Revolution

    In the evolution of semiconductor packaging towards high-density, high-frequency and three-dimensional integration, glass substrate has become the core carrier of a new generation of advanced packaging by virtue of its excellent high-frequency charac…

    Industry News 2025 年 8 月 18 日
  • Laser etching: unlock the core key for high-precision manufacturing of TGV glass vias

    Laser etching: unlock the core key for high-precision manufacturing of TGV glass vias

    In the wave of semiconductor packaging technology evolving to 3D integration, Glass through hole ( TGV )With the high frequency electrical characteristics, excellent insulation and adjustable coefficient of thermal expansion of glass materials, techn…

    Industry News 2025 年 8 月 13 日
  • Customizing the metallization of sapphire surface: precise solutions from material combination to process adaptation

    Customizing the metallization of sapphire surface: precise solutions from material combination to process adaptation

    In the field of modern high-end manufacturing, sapphire has become a key material in semiconductor, optoelectronics, aerospace and other industries with its ultra-high hardness, excellent chemical stability and excellent optical performance. However,…

    Industry News 2025 年 8 月 13 日
  • Defect Analysis and Solution in the Process of Sapphire Metallization

    Defect Analysis and Solution in the Process of Sapphire Metallization

    Sapphire metallization It is one of the widely used technologies in the modern semiconductor and optoelectronic industries, especially in the manufacturing process of LED, laser, integrated circuit and other fields. Sapphire materials are widely used…

    Industry News 2025 年 8 月 11 日
  • Semiconductor etching technology: precision processing promotes the progress of microelectronics industry

    Semiconductor etching technology: precision processing promotes the progress of microelectronics industry

    As one of the core processes in microelectronics manufacturing, semiconductor etching technology is widely used in integrated circuit (IC), micro electromechanical system (MEMS) and other fields. With the continuous development of the semiconductor i…

    Industry News 2025 年 8 月 11 日
  • Glass Etching: Surface Engineering Revolution from Light Control to Chip Interconnection

    Glass Etching: Surface Engineering Revolution from Light Control to Chip Interconnection

    The molecular layer on the surface of glass is quietly changing the face of modern industry. When the hydrofluoric acid solution reacts with silica, or the picosecond laser beam accurately bombards the glass surface, the etching process of the micro …

    Industry News 2025 年 8 月 4 日
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  • 石英玻璃金属化层的热稳定性研究 石英玻璃金属化层的热稳定性研究
  • 内窥镜镜头蓝宝石玻璃与不锈钢连接,技术挑战与解决方案 内窥镜镜头蓝宝石玻璃与不锈钢连接,技术挑战与解决方案
  • 玻璃基板升级战,tgv技术背后的材料选择逻辑 玻璃基板升级战,tgv技术背后的材料选择逻辑
  • 蓝宝石镜头耐磨损特性,为何成为高端光学设备的首选材料 蓝宝石镜头耐磨损特性,为何成为高端光学设备的首选材料
  • 内窥镜镜头蓝宝石玻璃与不锈钢连接:技术挑战与解决方案 内窥镜镜头蓝宝石玻璃与不锈钢连接:技术挑战与解决方案

近期文章

  • 石英玻璃金属化层的热稳定性研究
  • 内窥镜镜头蓝宝石玻璃与不锈钢连接,技术挑战与解决方案
  • 玻璃基板升级战,tgv技术背后的材料选择逻辑
  • 蓝宝石镜头耐磨损特性,为何成为高端光学设备的首选材料
  • 内窥镜镜头蓝宝石玻璃与不锈钢连接:技术挑战与解决方案

产品中心

  • LED封装玻璃透镜 玻璃盖板样式05

    LED封装玻璃透镜 玻璃盖板样式05

  • 反射膜-镀膜加工

    反射膜-镀膜加工

  • 芯片电阻 精密电阻

    芯片电阻 精密电阻

  • 封装晶圆

    封装晶圆

  • 圆形窗口片-窗口片

    圆形窗口片-窗口片

  • LED封装玻璃透镜 玻璃盖板样式06

    LED封装玻璃透镜 玻璃盖板样式06

常见问题

  • 问:贵公司光电玻璃产品可以定制吗?
  • 硅晶体类型都有什么?
  • 氟化锂在玻璃中的作用是什么?
  • 硒化锌和硫化锌的区别是什么?
  • 问:贵公司光电玻璃产品能否提供出口?
  • 振镜的应用有哪些?

标签云

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