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  2. Grooved Glass Cover Plate
  • Application of glass thinning technology in electronic equipment

    Application of glass thinning technology in electronic equipment

    A piece of glass with a thickness of only 30 microns (0.03mm), which is a quarter thinner than A4 paper, can withstand more than 1 million times Bend without breaking. This achievement, which seems to violate the common sense of materials, is quietly…

    Industry News 2025 年 8 月 27 日
  • Application of Etching Technology in Optoelectronic Materials

    Application of Etching Technology in Optoelectronic Materials

    Photoelectric materials are an indispensable part of modern science and technology, and are widely used in many fields such as display technology, solar cells, laser equipment and sensors. In these applications, etching technology, as an important pr…

    Industry News 2025 年 8 月 20 日
  • Breaking AI computing bottleneck: technical revolution and engineering breakthrough of glass substrate packaging

    Breaking AI computing bottleneck: technical revolution and engineering breakthrough of glass substrate packaging

    A silent revolution is taking place in the field of semiconductor packaging. With the proliferation of AI chip transistors, the traditional organic substrate has become exhausted: AMD’s new generation EPYC processor integrates 192 cores, NVIDIA…

    Industry News 2025 年 8 月 20 日
  • Grating etching technology: an important tool in the field of micro machining

    Grating etching technology: an important tool in the field of micro machining

    Grating Etching technology, as a key process in the field of micro machining, is widely used in high-tech industries such as optics, communication, semiconductor, etc. Its unique process flow and significant technical advantages make grating etching …

    Industry News 2025 年 8 月 18 日
  • Glass Through Hole (TGV) Technology: Breaking the Bottleneck of Micromachining and High Density Interconnection Revolution

    Glass Through Hole (TGV) Technology: Breaking the Bottleneck of Micromachining and High Density Interconnection Revolution

    In the evolution of semiconductor packaging towards high-density, high-frequency and three-dimensional integration, glass substrate has become the core carrier of a new generation of advanced packaging by virtue of its excellent high-frequency charac…

    Industry News 2025 年 8 月 18 日
  • Semiconductor etching technology: precision processing promotes the progress of microelectronics industry

    Semiconductor etching technology: precision processing promotes the progress of microelectronics industry

    As one of the core processes in microelectronics manufacturing, semiconductor etching technology is widely used in integrated circuit (IC), micro electromechanical system (MEMS) and other fields. With the continuous development of the semiconductor i…

    Industry News 2025 年 8 月 11 日
  • Glass Etching: Surface Engineering Revolution from Light Control to Chip Interconnection

    Glass Etching: Surface Engineering Revolution from Light Control to Chip Interconnection

    The molecular layer on the surface of glass is quietly changing the face of modern industry. When the hydrofluoric acid solution reacts with silica, or the picosecond laser beam accurately bombards the glass surface, the etching process of the micro …

    Industry News 2025 年 8 月 4 日
  • Glass via interconnection technology: packaging revolution of high-frequency chips

    Glass via interconnection technology: packaging revolution of high-frequency chips

    In the field of high-end chip packaging, a silent technological change is taking place. When the high frequency loss and complex process of silicon substrate gradually become the bottleneck of computing power improvement, a new interconnection techno…

    Industry News 2025 年 8 月 4 日
  • Selection of optical coating suppliers and analysis of technical advantages

    Selection of optical coating suppliers and analysis of technical advantages

    In the modern optical industry, optical coating technology is one of the key means to improve the performance of optical elements. Optical coating can improve light transmittance, enhance specular reflection, reduce reflection loss, etc. It is widely…

    Industry News 2025 年 7 月 30 日
  • Current Status and Future Development of Semiconductor Etching Technology

    Current Status and Future Development of Semiconductor Etching Technology

    The development of semiconductor technology has profoundly changed the design and manufacturing of modern electronic equipment. As one of the core processes in semiconductor processing, etching technology plays a crucial role. With the continuous dev…

    Industry News 2025 年 7 月 22 日
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  • 石英玻璃金属化在半导体制造中的应用与技术优势 石英玻璃金属化在半导体制造中的应用与技术优势
  • 化学镀镍工艺在玻璃金属化中的应用与优势 化学镀镍工艺在玻璃金属化中的应用与优势
  • 离子束溅射技术:提升玻璃金属化性能的革新之选 离子束溅射技术:提升玻璃金属化性能的革新之选
  • MEMS玻璃金属化:助力微机电系统在高科技领域的应用与创新 MEMS玻璃金属化:助力微机电系统在高科技领域的应用与创新
  • 低温玻璃金属化工艺:推动电子、光电和智能制造行业的创新应用 低温玻璃金属化工艺:推动电子、光电和智能制造行业的创新应用

近期文章

  • 石英玻璃金属化在半导体制造中的应用与技术优势
  • 化学镀镍工艺在玻璃金属化中的应用与优势
  • 离子束溅射技术:提升玻璃金属化性能的革新之选
  • MEMS玻璃金属化:助力微机电系统在高科技领域的应用与创新
  • 低温玻璃金属化工艺:推动电子、光电和智能制造行业的创新应用

产品中心

  • LED封装玻璃透镜 玻璃盖板样式08

    LED封装玻璃透镜 玻璃盖板样式08

  • LED封装玻璃透镜 玻璃盖板样式07

    LED封装玻璃透镜 玻璃盖板样式07

  • 蓝宝石金属化

    蓝宝石金属化

  • LED封装玻璃透镜 玻璃盖板样式06

    LED封装玻璃透镜 玻璃盖板样式06

  • 陶瓷

    陶瓷

  • LED封装玻璃透镜 玻璃盖板样式05

    LED封装玻璃透镜 玻璃盖板样式05

常见问题

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  • 蓝宝石金属化新手常见问题解答

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