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Application of glass thinning technology in electronic equipment
A piece of glass with a thickness of only 30 microns (0.03mm), which is a quarter thinner than A4 paper, can withstand more than 1 million times Bend without breaking. This achievement, which seems to violate the common sense of materials, is quietly…
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Application of Etching Technology in Optoelectronic Materials
Photoelectric materials are an indispensable part of modern science and technology, and are widely used in many fields such as display technology, solar cells, laser equipment and sensors. In these applications, etching technology, as an important pr…
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Breaking AI computing bottleneck: technical revolution and engineering breakthrough of glass substrate packaging
A silent revolution is taking place in the field of semiconductor packaging. With the proliferation of AI chip transistors, the traditional organic substrate has become exhausted: AMD’s new generation EPYC processor integrates 192 cores, NVIDIA…
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Grating etching technology: an important tool in the field of micro machining
Grating Etching technology, as a key process in the field of micro machining, is widely used in high-tech industries such as optics, communication, semiconductor, etc. Its unique process flow and significant technical advantages make grating etching …
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Glass Through Hole (TGV) Technology: Breaking the Bottleneck of Micromachining and High Density Interconnection Revolution
In the evolution of semiconductor packaging towards high-density, high-frequency and three-dimensional integration, glass substrate has become the core carrier of a new generation of advanced packaging by virtue of its excellent high-frequency charac…
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Semiconductor etching technology: precision processing promotes the progress of microelectronics industry
As one of the core processes in microelectronics manufacturing, semiconductor etching technology is widely used in integrated circuit (IC), micro electromechanical system (MEMS) and other fields. With the continuous development of the semiconductor i…
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Glass Etching: Surface Engineering Revolution from Light Control to Chip Interconnection
The molecular layer on the surface of glass is quietly changing the face of modern industry. When the hydrofluoric acid solution reacts with silica, or the picosecond laser beam accurately bombards the glass surface, the etching process of the micro …
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Glass via interconnection technology: packaging revolution of high-frequency chips
In the field of high-end chip packaging, a silent technological change is taking place. When the high frequency loss and complex process of silicon substrate gradually become the bottleneck of computing power improvement, a new interconnection techno…
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Selection of optical coating suppliers and analysis of technical advantages
In the modern optical industry, optical coating technology is one of the key means to improve the performance of optical elements. Optical coating can improve light transmittance, enhance specular reflection, reduce reflection loss, etc. It is widely…
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Current Status and Future Development of Semiconductor Etching Technology
The development of semiconductor technology has profoundly changed the design and manufacturing of modern electronic equipment. As one of the core processes in semiconductor processing, etching technology plays a crucial role. With the continuous dev…