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Market trend and future development of glass substrate
With the progress of science and technology and the growing demand for electronic products, Glass substrate As an important basic material, it has become an indispensable part of modern manufacturing. Especially in display technology, optoelectronic …
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Durability of glass thinning
As a widely used material, glass plays an indispensable role in many fields such as architecture, electronics, automobile, etc. In recent years, with the progress of technology, Glass thinning Technology has gradually become an important direction to…
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Grating etching technology: an important tool in the field of micro machining
Grating Etching technology, as a key process in the field of micro machining, is widely used in high-tech industries such as optics, communication, semiconductor, etc. Its unique process flow and significant technical advantages make grating etching …
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Glass Through Hole (TGV) Technology: Breaking the Bottleneck of Micromachining and High Density Interconnection Revolution
In the evolution of semiconductor packaging towards high-density, high-frequency and three-dimensional integration, glass substrate has become the core carrier of a new generation of advanced packaging by virtue of its excellent high-frequency charac…
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Laser etching: unlock the core key for high-precision manufacturing of TGV glass vias
In the wave of semiconductor packaging technology evolving to 3D integration, Glass through hole ( TGV )With the high frequency electrical characteristics, excellent insulation and adjustable coefficient of thermal expansion of glass materials, techn…
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Semiconductor etching technology: precision processing promotes the progress of microelectronics industry
As one of the core processes in microelectronics manufacturing, semiconductor etching technology is widely used in integrated circuit (IC), micro electromechanical system (MEMS) and other fields. With the continuous development of the semiconductor i…
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Glass Etching: Surface Engineering Revolution from Light Control to Chip Interconnection
The molecular layer on the surface of glass is quietly changing the face of modern industry. When the hydrofluoric acid solution reacts with silica, or the picosecond laser beam accurately bombards the glass surface, the etching process of the micro …
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Glass via interconnection technology: packaging revolution of high-frequency chips
In the field of high-end chip packaging, a silent technological change is taking place. When the high frequency loss and complex process of silicon substrate gradually become the bottleneck of computing power improvement, a new interconnection techno…
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High precision glass thinning: from micron level game to precision manufacturing revolution of industrial breakthrough
The “lightweight” demand of modern industry for glass has gone beyond simple size reduction and become an extreme game of material science, process control and engineering implementation. When the thickness of the cover glass of the foldi…
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Study on durability and reliability of quartz glass metallization
Quartz glass is widely used in many high-tech fields due to its excellent physical and chemical properties. Especially in electronics, optics, aerospace and other industries, quartz glass has become a key material due to its high temperature resistan…
