• Application of Dinghongrun optical elements in laser welding

    The laser welding technology consists of an optical oscillator and a medium placed between the mirrors at both ends of the oscillator cavity. When the medium is excited to a high energy state, it starts to produce in-phase light waves and reflect bac…

    ​​Case Studies 2024 年 10 月 24 日
  • Application of Dinghongrun optical elements in laser marking

    Laser marking is a technology that uses high energy density laser to irradiate the workpiece locally, so that the surface material will vaporize or undergo chemical reaction of color change, thus leaving permanent marks. The basic principle of laser …

    ​​Case Studies 2024 年 10 月 24 日
  • Application of Dinghongrun optical elements in laser medical treatment

    Laser medical treatment It is based on the selective photothermal effect of laser. When the laser beam irradiates the biological tissue, the laser of a specific wavelength will be absorbed by the pigment or water molecules in the target tissue and co…

    ​​Case Studies 2024 年 10 月 24 日
  • Infrared Optical Window​

    Infrared optical windows are optical materials designed to transmit infrared wavelengths, widely used in military, industrial, medical, and other fields. ​​Key Materials​​:Infrared optical windows require excellent infrared transmittance. Common mate…

    Metallized IR Windows, Metallized Series 2024 年 10 月 13 日
  • Photolithography Wafers

    Technical Specifications​​ ​​Process​​ ​​Capability & Precision​​ Photoresist Coating Spin Coating: Thickness accuracy ≤ 3% (flat surfaces) Photoresist Coating Spray Coating: Thickness accuracy ≤ 10% (flat/irregular surfaces) Lithography Accuracy…

    Semiconductor Applications 2024 年 10 月 13 日
  • Through-Glass Via (TGV) Wafers

    Technical Specifications​​ Parameter TGV Specifications ​​Material​​ Glass, Quartz, etc. ​​Wafer Size​​ 4”, 6”, 8”, 12”, etc. ​​Min. Thickness​​ 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) ​​Min. Aperture​​ 20μm ​​Taper Angle​​ 3~8° ​​Via Pitch​​ 50μm, …

    Semiconductor Applications 2024 年 10 月 13 日
  • Packaging Wafers​

    We provide customized packaging wafers for advanced semiconductor applications, engineered to meet specific performance requirements in microelectronics integration.

    Semiconductor Applications 2024 年 10 月 13 日
  • Carrier Wafers 

    Technical Specifications Parameter Specification ​​Material​​ Glass, Quartz, etc. ​​Diameter​​ 4”, 6”, 8”, 12” (customizable) ​​Diameter Tolerance​​ ±0.01mm ​​Min. Thickness​​ 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) ​​TTV (Total Thickness Variation)…

    Semiconductor Applications 2024 年 10 月 13 日
  • Anti-Reflection (AR) Coating Processing

    AR Coating Technology Anti-Reflection (AR) coatings, also known as anti-reflective films, are specialized optical coatings applied to glass surfaces to enhance light transmission. By leveraging interference effects created by multiple dielectric laye…

    Coating, Etching & Thinning 2024 年 10 月 13 日
  • Laser coating – coating processing

    Laser film The laser film has the characteristics of high-energy laser transmission, and is usually made of composite materials such as PET. In laser cutting, it can effectively absorb laser power, avoid smoke and dust during cutting, and protect cut…

    Coating, Etching & Thinning 2024 年 10 月 13 日