In the field of electronic packaging, a quiet cost revolution is under way. Glass through hole （ TGV ）Technology is challenging the dominant position of traditional hole technology with its amazing cost-effectiveness. In the semiconductor industry, e…

With the progress of science and technology and the growing demand for electronic products, Glass substrate As an important basic material, it has become an indispensable part of modern manufacturing. Especially in display technology, optoelectronic …

A silent revolution is taking place in the field of semiconductor packaging. With the proliferation of AI chip transistors, the traditional organic substrate has become exhausted: AMD’s new generation EPYC processor integrates 192 cores, NVIDIA…

In the evolution of semiconductor packaging towards high-density, high-frequency and three-dimensional integration, glass substrate has become the core carrier of a new generation of advanced packaging by virtue of its excellent high-frequency charac…

In the wave of semiconductor packaging technology evolving to 3D integration, Glass through hole （ TGV ）With the high frequency electrical characteristics, excellent insulation and adjustable coefficient of thermal expansion of glass materials, techn…

In the field of high-end chip packaging, a silent technological change is taking place. When the high frequency loss and complex process of silicon substrate gradually become the bottleneck of computing power improvement, a new interconnection techno…

With the increasing function and integration of electronic products, packaging technology has gradually become an important factor affecting product performance, reliability and cost. Among many packaging materials, Glass substrate Because of its exc…

In the race for device miniaturization and performance limit, a technology originating from semiconductor packaging is quietly changing the gene of intelligent devices. Glass through hole (TGV) technology – through Glass substrate To build a ve…

Glass substrate As an important material, it is widely used in modern industry, especially in displays, solar cells, photovoltaic industry and biomedical fields. With the continuous development of science and technology, the performance and applicati…

Photoetching is one of the key steps in modern semiconductor manufacturing, which is widely used in chip production, microelectronic device manufacturing and integrated circuit manufacturing. This technology accurately transfers the designed circuit …