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Application of Etching Technology in Optoelectronic Materials
Photoelectric materials are an indispensable part of modern science and technology, and are widely used in many fields such as display technology, solar cells, laser equipment and sensors. In these applications, etching technology, as an important pr…
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Breaking AI computing bottleneck: technical revolution and engineering breakthrough of glass substrate packaging
A silent revolution is taking place in the field of semiconductor packaging. With the proliferation of AI chip transistors, the traditional organic substrate has become exhausted: AMD’s new generation EPYC processor integrates 192 cores, NVIDIA…
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Durability of glass thinning
As a widely used material, glass plays an indispensable role in many fields such as architecture, electronics, automobile, etc. In recent years, with the progress of technology, Glass thinning Technology has gradually become an important direction to…
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Application prospect of sapphire metallization in aerospace field
Sapphire, as an excellent material, has been widely used in many high-tech fields due to its excellent hardness, thermal conductivity and optical transparency. With the progress of aerospace technology, Sapphire metallization As an important part, te…
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Grating etching technology: an important tool in the field of micro machining
Grating Etching technology, as a key process in the field of micro machining, is widely used in high-tech industries such as optics, communication, semiconductor, etc. Its unique process flow and significant technical advantages make grating etching …
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Glass Through Hole (TGV) Technology: Breaking the Bottleneck of Micromachining and High Density Interconnection Revolution
In the evolution of semiconductor packaging towards high-density, high-frequency and three-dimensional integration, glass substrate has become the core carrier of a new generation of advanced packaging by virtue of its excellent high-frequency charac…
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Laser etching: unlock the core key for high-precision manufacturing of TGV glass vias
In the wave of semiconductor packaging technology evolving to 3D integration, Glass through hole ( TGV )With the high frequency electrical characteristics, excellent insulation and adjustable coefficient of thermal expansion of glass materials, techn…
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Customizing the metallization of sapphire surface: precise solutions from material combination to process adaptation
In the field of modern high-end manufacturing, sapphire has become a key material in semiconductor, optoelectronics, aerospace and other industries with its ultra-high hardness, excellent chemical stability and excellent optical performance. However,…
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Defect Analysis and Solution in the Process of Sapphire Metallization
Sapphire metallization It is one of the widely used technologies in the modern semiconductor and optoelectronic industries, especially in the manufacturing process of LED, laser, integrated circuit and other fields. Sapphire materials are widely used…
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Semiconductor etching technology: precision processing promotes the progress of microelectronics industry
As one of the core processes in microelectronics manufacturing, semiconductor etching technology is widely used in integrated circuit (IC), micro electromechanical system (MEMS) and other fields. With the continuous development of the semiconductor i…