A silent revolution is taking place in the field of semiconductor packaging. With the proliferation of AI chip transistors, the traditional organic substrate has become exhausted: AMD’s new generation EPYC processor integrates 192 cores, NVIDIA…

As a widely used material, glass plays an indispensable role in many fields such as architecture, electronics, automobile, etc. In recent years, with the progress of technology, Glass thinning Technology has gradually become an important direction to…

Sapphire, as an excellent material, has been widely used in many high-tech fields due to its excellent hardness, thermal conductivity and optical transparency. With the progress of aerospace technology, Sapphire metallization As an important part, te…

Grating Etching technology, as a key process in the field of micro machining, is widely used in high-tech industries such as optics, communication, semiconductor, etc. Its unique process flow and significant technical advantages make grating etching …

In the evolution of semiconductor packaging towards high-density, high-frequency and three-dimensional integration, glass substrate has become the core carrier of a new generation of advanced packaging by virtue of its excellent high-frequency charac…

In the wave of semiconductor packaging technology evolving to 3D integration, Glass through hole （ TGV ）With the high frequency electrical characteristics, excellent insulation and adjustable coefficient of thermal expansion of glass materials, techn…

In the field of modern high-end manufacturing, sapphire has become a key material in semiconductor, optoelectronics, aerospace and other industries with its ultra-high hardness, excellent chemical stability and excellent optical performance. However,…

Sapphire metallization It is one of the widely used technologies in the modern semiconductor and optoelectronic industries, especially in the manufacturing process of LED, laser, integrated circuit and other fields. Sapphire materials are widely used…

As one of the core processes in microelectronics manufacturing, semiconductor etching technology is widely used in integrated circuit (IC), micro electromechanical system (MEMS) and other fields. With the continuous development of the semiconductor i…

In the field of high-end chip packaging, a silent technological change is taking place. When the high frequency loss and complex process of silicon substrate gradually become the bottleneck of computing power improvement, a new interconnection techno…