Glass substrate It plays a vital role in modern electronic equipment, especially in the production of displays, solar cells and electronic components. As the core foundation of load circuit and display material, it requires high transparency, accurat…

As an important micro machining technology, glass substrate micro via technology has been widely used in semiconductor, electronic packaging, optical display and other fields. With the development of electronic devices towards higher density and smal…

In the traditional high-speed circuit design, the signal integrity loss in the tiny hole is like an unsolved puzzle, which continues to puzzle engineers. The roughness, voids and uneven thickness in the copper plated through-hole are like invisible e…

In modern electronic packaging technology, glass has become a critical high-performance material widely used in various advanced technological products. Particularly in microelectronics, glass vias (Through Glass Vias, TGV) serve as a key technology …

Technical Specifications​​ Parameter TGV Specifications ​​Material​​ Glass, Quartz, etc. ​​Wafer Size​​ 4”, 6”, 8”, 12”, etc. ​​Min. Thickness​​ 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) ​​Min. Aperture​​ 20μm ​​Taper Angle​​ 3~8° ​​Via Pitch​​ 50μm, …

We provide customized packaging wafers for advanced semiconductor applications, engineered to meet specific performance requirements in microelectronics integration.

Technical Specifications Parameter Specification ​​Material​​ Glass, Quartz, etc. ​​Diameter​​ 4”, 6”, 8”, 12” (customizable) ​​Diameter Tolerance​​ ±0.01mm ​​Min. Thickness​​ 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) ​​TTV (Total Thickness Variation)…