The laser welding technology consists of an optical oscillator and a medium placed between the mirrors at both ends of the oscillator cavity. When the medium is excited to a high energy state, it starts to produce in-phase light waves and reflect bac…

Laser marking is a technology that uses high energy density laser to irradiate the workpiece locally, so that the surface material will vaporize or undergo chemical reaction of color change, thus leaving permanent marks. The basic principle of laser …

Laser medical treatment It is based on the selective photothermal effect of laser. When the laser beam irradiates the biological tissue, the laser of a specific wavelength will be absorbed by the pigment or water molecules in the target tissue and co…

Core Application Fields 1. Power Electronics (Dominant Market) 2. RF/Microwave (High-Frequency Applications) 3. Optoelectronics & Sensing (Precision Interconnects) 4. Advanced Packaging (Emerging Frontier) Technical Value Proposition Metallized l…

Core Functionality: Thermal Management & Structural Support 1. ​​Thermal Conduction Hub​​ 2. ​​Mechanical Stress Coordination​​ 3. ​​Electrical Interconnection Platform​​ 4. ​​Sealed Packaging Foundation​​ 5. ​​Optical Alignment Benchmark​​ ​​Tec…

Infrared optical windows are optical materials designed to transmit infrared wavelengths, widely used in military, industrial, medical, and other fields. ​​Key Materials​​:Infrared optical windows require excellent infrared transmittance. Common mate…

Ding Hongrun provides metallized sapphire infrared optical windows that can be directly welded or installed onto optomechanical assemblies to achieve hermetic sealing. They are widely applicable in fields such as fiber optic communications, infrared …

Technical Specifications​​ ​​Process​​ ​​Capability & Precision​​ Photoresist Coating Spin Coating: Thickness accuracy ≤ 3% (flat surfaces) Photoresist Coating Spray Coating: Thickness accuracy ≤ 10% (flat/irregular surfaces) Lithography Accuracy…

Technical Specifications​​ Parameter TGV Specifications ​​Material​​ Glass, Quartz, etc. ​​Wafer Size​​ 4”, 6”, 8”, 12”, etc. ​​Min. Thickness​​ 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) ​​Min. Aperture​​ 20μm ​​Taper Angle​​ 3~8° ​​Via Pitch​​ 50μm, …

We provide customized packaging wafers for advanced semiconductor applications, engineered to meet specific performance requirements in microelectronics integration.