• Carrier Wafers 

    Technical Specifications Parameter Specification ​​Material​​ Glass, Quartz, etc. ​​Diameter​​ 4”, 6”, 8”, 12” (customizable) ​​Diameter Tolerance​​ ±0.01mm ​​Min. Thickness​​ 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) ​​TTV (Total Thickness Variation)…

    Semiconductor Applications 2024 年 10 月 13 日
  • Substrate Wafers

    Product Description Substrate wafers serve as foundational materials in semiconductor device manufacturing, providing structural support for functional layer integration. We offer customized substrate wafers tailored to specific technical requirement…

    Semiconductor Applications 2024 年 10 月 13 日
  • Anti-Reflection (AR) Coating Processing

    AR Coating Technology Anti-Reflection (AR) coatings, also known as anti-reflective films, are specialized optical coatings applied to glass surfaces to enhance light transmission. By leveraging interference effects created by multiple dielectric laye…

    Coating, Etching & Thinning 2024 年 10 月 13 日
  • Laser coating – coating processing

    Laser film The laser film has the characteristics of high-energy laser transmission, and is usually made of composite materials such as PET. In laser cutting, it can effectively absorb laser power, avoid smoke and dust during cutting, and protect cut…

    Coating, Etching & Thinning 2024 年 10 月 13 日
  • Reflective film – coating processing

    Reflective film The reflective film enables its surface to reflect light. It is usually composed of several material layers, and the thickness and refractive index of each layer are carefully designed to make the reflectivity reach the ideal state. I…

    Coating, Etching & Thinning 2024 年 10 月 13 日
  • Coating processing

    Coating processing Optical coating refers to coating one or more layers of metal or dielectric films on the surface of optical parts. The purpose is to change the reflection and transmission characteristics of the material surface to reduce or increa…

    Coating, Etching & Thinning 2024 年 10 月 13 日