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Carrier Wafers
Technical Specifications Parameter Specification Material Glass, Quartz, etc. Diameter 4”, 6”, 8”, 12” (customizable) Diameter Tolerance ±0.01mm Min. Thickness 0.2mm (<6”), 0.3mm (8”), 0.35mm (12”) TTV (Total Thickness Variation)…
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Substrate Wafers
Product Description Substrate wafers serve as foundational materials in semiconductor device manufacturing, providing structural support for functional layer integration. We offer customized substrate wafers tailored to specific technical requirement…
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Anti-Reflection (AR) Coating Processing
AR Coating Technology Anti-Reflection (AR) coatings, also known as anti-reflective films, are specialized optical coatings applied to glass surfaces to enhance light transmission. By leveraging interference effects created by multiple dielectric laye…
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Laser coating – coating processing
Laser film The laser film has the characteristics of high-energy laser transmission, and is usually made of composite materials such as PET. In laser cutting, it can effectively absorb laser power, avoid smoke and dust during cutting, and protect cut…
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Reflective film – coating processing
Reflective film The reflective film enables its surface to reflect light. It is usually composed of several material layers, and the thickness and refractive index of each layer are carefully designed to make the reflectivity reach the ideal state. I…
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Coating processing
Coating processing Optical coating refers to coating one or more layers of metal or dielectric films on the surface of optical parts. The purpose is to change the reflection and transmission characteristics of the material surface to reduce or increa…
